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Patent Searching and Data


Title:
RESIN POWDER, SEALING MATERIAL, ELECTRONIC COMPONENT, AND RESIN POWDER MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/193959
Kind Code:
A1
Abstract:
This resin powder comprises aggregates of spherical particles of a resin composition. The resin composition contains: a resin component which includes a thermosetting resin; and a non-resin component which includes electrically insulative inorganic particles and/or magnetic particles.

Inventors:
TSUZUKI TAKANORI
TAKASHIRO JUNICHI
BABA DAIZOU
Application Number:
PCT/JP2019/011071
Publication Date:
October 10, 2019
Filing Date:
March 18, 2019
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08J3/12; C08K3/01; C08L101/00; H01L23/29; H01L23/31
Domestic Patent References:
WO2016017801A12016-02-04
Foreign References:
JP2014094981A2014-05-22
JP2013127022A2013-06-27
JPH083472A1996-01-09
JPH06144918A1994-05-24
JP2016031387A2016-03-07
JP2011008163A2011-01-13
JP2005132700A2005-05-26
JPH11114403A1999-04-27
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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