Title:
RESIN POWDER, SEALING MATERIAL, ELECTRONIC COMPONENT, AND RESIN POWDER MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/193959
Kind Code:
A1
Abstract:
This resin powder comprises aggregates of spherical particles of a resin composition. The resin composition contains: a resin component which includes a thermosetting resin; and a non-resin component which includes electrically insulative inorganic particles and/or magnetic particles.
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Inventors:
TSUZUKI TAKANORI
TAKASHIRO JUNICHI
BABA DAIZOU
TAKASHIRO JUNICHI
BABA DAIZOU
Application Number:
PCT/JP2019/011071
Publication Date:
October 10, 2019
Filing Date:
March 18, 2019
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08J3/12; C08K3/01; C08L101/00; H01L23/29; H01L23/31
Domestic Patent References:
WO2016017801A1 | 2016-02-04 |
Foreign References:
JP2014094981A | 2014-05-22 | |||
JP2013127022A | 2013-06-27 | |||
JPH083472A | 1996-01-09 | |||
JPH06144918A | 1994-05-24 | |||
JP2016031387A | 2016-03-07 | |||
JP2011008163A | 2011-01-13 | |||
JP2005132700A | 2005-05-26 | |||
JPH11114403A | 1999-04-27 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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