Title:
RESIN-SEALED MODULE PRODUCTION METHOD AND RESIN-SEALED MODULE
Document Type and Number:
WIPO Patent Application WO/2016/059699
Kind Code:
A1
Abstract:
Provided is a production method for a resin-sealed module, having: a pouring step in which uncured liquid curable resin is poured into a module case; and a positioning step in which a mold member is positioned. In the pouring step, a substrate having an electronic component attached thereto is immersed in the liquid curable resin. In the positioning step, the mold member is positioned such that an inside space of a first partitioning wall faces a second area. In the positioning step, a partial area of the upper surface of the liquid curable resin is pressed down by a gas layer and this area is positioned lower than other areas, as a result of the gas layer being held in the inside space and at least a protruding end section of the first partitioning wall being immersed in the liquid curable resin.
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Inventors:
HASEGAWA MASAAKI (JP)
Application Number:
PCT/JP2014/077528
Publication Date:
April 21, 2016
Filing Date:
October 16, 2014
Export Citation:
Assignee:
SHINDENGEN ELECTRIC MFG (JP)
International Classes:
H01L21/56; H01L23/28
Foreign References:
| JP2013207172A | 2013-10-07 | |||
| JP2012186371A | 2012-09-27 | |||
| JP2013115265A | 2013-06-10 | |||
| JP2013115265A | 2013-06-10 |
Other References:
See also references of EP 3208834A4
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
Sumio Tanai (JP)
Sumio Tanai (JP)
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