Title:
RESIN SEALED SEMICONDUCTOR DEVICE WHOSE UPPER PORTION IS PROVIDED WITH HEAT DISSIPATING BODY EXPOSED TO EXTERNAL AND METHOD FOR MANUFACTURING SUCH RESIN SEALED SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2007/080785
Kind Code:
A1
Abstract:
A resin sealed body (4) is provided with a notched section (14) for exposing outside
one upper surface electrode (12a) of a semiconductor element (2) and the inner
end portion (13) of a lead terminal (3a). A conductive heat dissipating body (5)
is provided with a heat dissipating main body (15) arranged on an upper surface
(4a) of the resin sealed body (4), and a connecting section (16), which electrically
connects the heat dissipating body main body (15), the upper surface electrode
(12a) of the semiconductor element (2) and the lead terminal (3a), respectively,
through the notched section (14) of the resin sealed body (4). The heat capacity
of the heat dissipating body (5) can be changed as needed by changing the shape
of the heat dissipating body main body (15). Furthermore, since a current path
is formed by connecting the connecting section (16) with the lead terminal (3a),
a conventional lead frame can be used as it is, without changing the shape of an
external lead (3).
Inventors:
SHIOMI, Arata (6-3, Kitano 3-chom, Niiza-shi Saitama 66, 3528666, JP)
Application Number:
JP2006/326012
Publication Date:
July 19, 2007
Filing Date:
December 27, 2006
Export Citation:
Assignee:
Sanken Electric Co., Ltd. (6-3 Kitano 3-chome, Niiza-shi Saitama, 66, 3528666, JP)
サンケン電気株式会社 (〒66 埼玉県新座市北野３丁目６番３号 Saitama, 3528666, JP)
サンケン電気株式会社 (〒66 埼玉県新座市北野３丁目６番３号 Saitama, 3528666, JP)
International Classes:
H01L23/36; H01L21/60; H01L23/28
Attorney, Agent or Firm:
SHIMIZU, Keiichi (Kouwa Patent Office, 3rd Floor YK Nakameguro Building, 1-5, Nakameguro 3-chom, Meguro-ku Tokyo 61, 1530061, JP)
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