Title:
RESIN-SEALED SENSOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/203554
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a resin-sealed sensor device formed by mounting a sensor element for detecting an inertial force such as acceleration or angular velocity on a pad and sealing the entirety thereof in a resin, said resin-sealed sensor device being provided such that tilting or deformation of the sensor element or pad during resin injection is reduced or eliminated so as to suppress or eliminate sensor output errors and ensure that the resin-sealed sensor device is highly reliable. The resin-sealed sensor device (100) according to the present invention is constituted by a circuit unit (10) and a molded resin body (20) sealing the circuit unit (10), said circuit unit (10) comprising a sensor element (1) for physical quantity detection, a circuit board (2), a pad (3) which has a shape in planar view of any among a rectangle, a circle, and an ellipse, hanger leads (5A to 5D) and external power leads (4) connected to the pad (3). A hanger lead (5A to 5D) is arranged in each of the divided regions that can be formed from the shape of the pad (3) being virtually divided into four regions when the intersection (O) of two orthogonal axes (L1,L2) coincides with the center of the shape of the pad (3).
More Like This:
| JPS6276749 | LEAD FRAME AND MANUFACTURING THEREOF |
| JPS63122256 | SEMICONDUCTOR DEVICE |
| JPH05283598 | TAPED ELECTRONIC PARTS AND TAPING METHOD FOR ELECTRONIC PARTS |
Inventors:
YAGUCHI AKIHIRO (JP)
HAYASHI MASAHIDE (JP)
HAYASHI MASAHIDE (JP)
Application Number:
PCT/JP2014/052603
Publication Date:
December 24, 2014
Filing Date:
February 05, 2014
Export Citation:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
International Classes:
H01L23/50; G01C19/5783; G01P15/08; G01P15/18; H01L23/28; H01L29/84
Foreign References:
| JP2011044601A | 2011-03-03 | |||
| JP2013062351A | 2013-04-04 | |||
| JP2013044524A | 2013-03-04 | |||
| JP2007048994A | 2007-02-22 | |||
| JP2007066967A | 2007-03-15 | |||
| JP2006229263A | 2006-08-31 |
Attorney, Agent or Firm:
INOUE Manabu et al. (JP)
Manabu Inoue (JP)
Manabu Inoue (JP)
Download PDF:
Previous Patent: GAS SENSOR DEVICE AND ATTACHMENT STRUCTURE FOR GAS SENSOR DEVICE
Next Patent: PHYSICAL QUANTITY MEASURING APPARATUS
Next Patent: PHYSICAL QUANTITY MEASURING APPARATUS