Title:
RESIN SEALING DEVICE, RESIN SEALING METHOD, AND MOLD FOR RESIN SEALING
Document Type and Number:
WIPO Patent Application WO/2017/138386
Kind Code:
A1
Abstract:
An electrostatic chuck provided to the surface of a top mold is used to sequentially or simultaneously draw together, by means of the attractive force of static electricity, a substrate on which a chip is mounted and a releasing film. This causes the substrate and the releasing film to be closely adhered to and retained on the surface of the top mold while being closely adhered to each other. By closing the top and bottom molds, the substrate and the chip mounted on the substrate are submerged in molten resin inside of the cavity. When seen in plan view, the substrate is contained in the cavity, and therefore the substrate and chip are completely submerged in the molten resin. Once resin sealing has been completed, the top and side surfaces of the substrate and chip will be covered by hardened resin.
Inventors:
TAMURA TAKASHI (JP)
TAKADA NAOKI (JP)
KITA HITOSHI (JP)
KAWAMOTO YOSHIHISA (JP)
TAKADA NAOKI (JP)
KITA HITOSHI (JP)
KAWAMOTO YOSHIHISA (JP)
Application Number:
PCT/JP2017/003171
Publication Date:
August 17, 2017
Filing Date:
January 30, 2017
Export Citation:
Assignee:
TOWA CORP (JP)
International Classes:
H01L21/56; B29C43/18; B29C43/34; B29C43/36
Foreign References:
| JP2016022672A | 2016-02-08 | |||
| JP2014231185A | 2014-12-11 | |||
| JP2013176874A | 2013-09-09 |
Attorney, Agent or Firm:
OKADA Kazuhide (JP)
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