Title:
RESIN-SEALING DEVICE AND RESIN-SEALING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/081881
Kind Code:
A1
Abstract:
Provided is a resin-sealing device capable of balancing suppression of substrate warping and double-sided molding of the substrate. This resin-sealing device resin-seals both surfaces of a substrate by compression molding, and is characterized in that one mold among an upper mold and a lower mold includes a rigid member and a first elastic member, while the other of the molds includes a second elastic member exhibiting a larger spring constant than the first elastic member, and in that: the rigid member stops the movement by an upper-mold frame member or a lower-mold frame member in the direction that opens/closes the upper and lower molds; or a substrate pin is provided on the outside of a lower-mold cavity so as to project upward, and it is possible to mount the substrate pin while the substrate has been released from the top surface of the lower mold; or an outside-air blocking member and a substrate support means are also provided in the resin-sealing device, and while the mold cavity interior is depressurized and a substrate surface that has not been resin-sealed is supported, it is possible to resin-seal the other surface thereof by compression molding.
Inventors:
TAKASE SHINJI (JP)
ONISHI YOHEI (JP)
TAKA TAKEAKI (JP)
ONISHI YOHEI (JP)
TAKA TAKEAKI (JP)
Application Number:
PCT/JP2016/069184
Publication Date:
May 18, 2017
Filing Date:
June 28, 2016
Export Citation:
Assignee:
TOWA CORP (JP)
International Classes:
H01L23/29; B29C43/18; B29C43/36; H01L21/56; H01L23/31
Foreign References:
| JP2015013371A | 2015-01-22 | |||
| JP2008201055A | 2008-09-04 | |||
| JPH091596A | 1997-01-07 | |||
| JP2010016137A | 2010-01-21 |
Attorney, Agent or Firm:
TSUJIMARU Koichiro et al. (JP)
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