Title:
RESIN SEALING DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/018655
Kind Code:
A1
Abstract:
The present invention addresses the problem of realizing a resin sealing device capable of reducing the temperature of a sealing mold in a short time. As a solution, the present invention provides a resin sealing device (1) that uses a sealing mold (202) including an upper mold (204) and a lower mold (206), to seal a workpiece (W) with resin, thus processing the workpiece into a molded product (Wp). The resin sealing device includes a lower-mold mold base (236) to which the lower mold (206) is fixed. The lower-mold mold base (236) is fixed to a lower-mold backup plate (216) with a plurality of lower-mold pillars (276) being interposed therebetween, and is provided with a lower-mold cooling plate (286) that cools the lower-mold mold base (236) by being made to abut against or by being made to come close to a lower surface (236a) of the lower-mold mold base (236) in a lower-mold space section (296) where the lower-mold pillars (276) are arranged.
Inventors:
FUJISAWA MASAHIKO (JP)
OKAMOTO MASASHI (JP)
OKAMOTO MASASHI (JP)
Application Number:
PCT/JP2023/003147
Publication Date:
January 25, 2024
Filing Date:
February 01, 2023
Export Citation:
Assignee:
APIC YAMADA CORP (JP)
International Classes:
B29C33/04; B29C43/18; B29C43/34; B29C43/52; B29C45/02; B29C45/14; B29C45/26; B29C45/73; H01L21/56
Foreign References:
| JP2020082509A | 2020-06-04 | |||
| JPH02102009A | 1990-04-13 | |||
| JPH0631736A | 1994-02-08 | |||
| JPH02209223A | 1990-08-20 | |||
| JPS56130332A | 1981-10-13 | |||
| JP2017071057A | 2017-04-13 |
Attorney, Agent or Firm:
WATANUKI PATENT SERVICE BUREAU (JP)
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