Title:
RESIN SEALING MOLD ADJUSTING METHOD AND RESIN SEALING MOLD
Document Type and Number:
WIPO Patent Application WO/2019/017186
Kind Code:
A1
Abstract:
[Problem] To provide a resin sealing mold adjusting method and a resin sealing mold which are capable of easily coping with a change in the thickness of a resin molding part, in a resin sealing package. [Solution] According to the present invention, an upper mold 1 is composed of an upper mold die set 11 and an upper mold chess 12. The upper mold die set 11 is a member which supports the upper mold chess 12. In addition, the upper mold chess 12 has a holder base 20, a base plate 30, and a package insert 40. Spring members 60 are disposed between the holder base 20 and the base plate 30 and downwardly bias the holder base 20 and the package insert 40.
Inventors:
MIYAHARA HIROAKI (JP)
Application Number:
PCT/JP2018/024875
Publication Date:
January 24, 2019
Filing Date:
June 29, 2018
Export Citation:
Assignee:
DAI ICHI SEIKO CO LTD (JP)
International Classes:
B29C45/26
Domestic Patent References:
| WO2016203779A1 | 2016-12-22 |
Foreign References:
| JP2011011426A | 2011-01-20 | |||
| JP2013028087A | 2013-02-07 |
Attorney, Agent or Firm:
ARIYOSHI Shuichiro et al. (JP)
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