Title:
RESIN SHEET FOR CONNECTING CIRCUIT MEMBERS
Document Type and Number:
WIPO Patent Application WO/2017/090439
Kind Code:
A1
Abstract:
Provided is a resin sheet for connecting circuit members, said sheet being interposed between opposing electrodes and used to electrically connect the opposing electrodes. The resin sheet for connecting circuit members is characterized in that the material constituting the resin sheet has a melt viscosity of 1.0×100-5.0×105 Pa･s at 90 ºC before curing, and has, in the form of a cured article, an average linear expansion coefficient of 45 ppm or less at 0-130 ºC. Such a resin sheet for connecting circuit members is not susceptible to changes in the connection resistance at connection sections when circuit members are connected with each other, and thus, a high reliability is achieved.
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Inventors:
TSUCHIYA KAZUHIRO (JP)
SUGINO TAKASHI (JP)
NEZU YUSUKE (JP)
SUGINO TAKASHI (JP)
NEZU YUSUKE (JP)
Application Number:
PCT/JP2016/083334
Publication Date:
June 01, 2017
Filing Date:
November 10, 2016
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/60; C09J7/10; C09J159/00; C09J167/00
Domestic Patent References:
| WO2013125684A1 | 2013-08-29 |
Foreign References:
| JP2011047084A | 2011-03-10 | |||
| JP2014192237A | 2014-10-06 |
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
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