Title:
RESIN SHEET, CONTAINER, CARRIER TAPE, AND ELECTRONIC COMPONENT PACKAGING
Document Type and Number:
WIPO Patent Application WO/2023/189186
Kind Code:
A1
Abstract:
This resin sheet includes a base sheet containing a polystyrene resin, and has a maximum puncture elastic modulus of 2.4-6.4 MPa as calculated by the following procedure. Calculation procedure for maximum puncture elastic modulus: a measurement sample is fixed to a flat jig having a hole with a diameter of 1.0 mm in the center, the load L (N) and the strain amount ε in the piercing direction when a cylindrical needle with a flat tip and a diameter of 0.8 mm pierces the surface of the measurement sample perpendicularly at a speed of 0.5 mm/min are measured, and the maximum puncture elastic modulus is set as the value at which the ratio of the stress difference and the strain amount difference calculated using the formula (ΔL/S)/Δε (in the formula, S indicates the area (mm2) of the tip surface of the needle) is maximum at 0.1 ≤ ε ≤ 5.0.
Inventors:
INODA IKUKA (JP)
YANAKA RYOSUKE (JP)
YANAKA RYOSUKE (JP)
Application Number:
PCT/JP2023/007898
Publication Date:
October 05, 2023
Filing Date:
March 02, 2023
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C08J5/18; B32B27/30; B65D65/40; B65D85/86
Domestic Patent References:
| WO2019045030A1 | 2019-03-07 |
Foreign References:
| JP2020114675A | 2020-07-30 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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