RESIN SHEET, CONTAINER, CARRIER TAPE, AND ELECTRONIC COMPONENT PACKAGING

Title:

RESIN SHEET, CONTAINER, CARRIER TAPE, AND ELECTRONIC COMPONENT PACKAGING

Document Type and Number:

WIPO Patent Application WO/2023/189190

Kind Code:

A1

Abstract:

A resin sheet comprising: a base material sheet that contains a polystyrene-based resin; and a surface layer that is laminated on at least one surface of the base material sheet and that contains an electrically conductive material and a thermoplastic resin, wherein a durometer D-type surface hardness of the resin sheet as measured in compliance with JIS-K-7215 is not less than 67 but less than 80.

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Inventors:

INODA IKUKA (JP)
YANAKA RYOSUKE (JP)

Application Number:

PCT/JP2023/007922

Publication Date:

October 05, 2023

Filing Date:

March 02, 2023

Export Citation:

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Assignee:

DENKA COMPANY LTD (JP)

International Classes:

B32B27/30; B32B27/00; B65D65/40; B65D85/86

Domestic Patent References:

WO2018084129A1

2018-05-11

Foreign References:

JP2002301792A	2002-10-15
JP2019010845A	2019-01-24

Attorney, Agent or Firm:

HASEGAWA Yoshiki et al. (JP)

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