Title:
RESIN SHEET FOR ELECTRONIC COMPONENT, FILM-PROTECTED RESIN SHEET FOR ELECTRONIC COMPONENT, AND SEMICONDUCTOR DEVICE AND PRODUCTION PROCESS THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/029744
Kind Code:
A1
Abstract:
An adhesive sheet having a low water-vapor permeability and having high elasticity before heat curing is provided. This adhesive sheet enables electronic appliances to have improved reliability to, for example, give better results of dielectric breakdown tests. Also provided is a process whereby an electronic appliance having a hollow of a desired shape can be easily produced. The adhesive sheet is a resin sheet for electronic components, characterized by comprising (a) an acrylic copolymer, (b) a thermosetting resin, (c) an inorganic filler, and (d) a silane coupling agent having an amino group, the acrylic copolymer (a) containing acrylonitrile units in an amount of 30 mol% or larger of the constituent monomer units. The resin sheet is further characterized by having a content of the acrylic copolymer (a) of 2-5 wt%.
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Inventors:
MATSUMOTO AKIKO (JP)
MAEDA AKIHIRO (JP)
SHINOHARA HIDEKI (JP)
MAEDA AKIHIRO (JP)
SHINOHARA HIDEKI (JP)
Application Number:
PCT/JP2016/073277
Publication Date:
February 15, 2018
Filing Date:
August 08, 2016
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
H01L23/29; C08J5/18; C08L33/20; H01L21/56; H01L23/31
Foreign References:
| JP2015106698A | 2015-06-08 | |||
| JP2015195267A | 2015-11-05 | |||
| JP2013127034A | 2013-06-27 | |||
| JP2014189791A | 2014-10-06 |
Attorney, Agent or Firm:
ICHIJO, Chikara (JP)
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