Title:
RESIN SHEET AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2016/088744
Kind Code:
A1
Abstract:
The purpose is to provide a resin sheet serviceable as an insulating layer in a printed wiring board material, the resin sheet including a resin composition which, when made into a resin sheet, has excellent ease of handling, as well as affording excellent cohesion between the insulating layer and a conducting layer formed by plating the surface thereof. This resin sheet includes an outer layer of any one material selected from the group consisting of polymer films, metal foils, and metal films, and an insulating layer laminated onto the outer layer, wherein the insulating layer contains an epoxy compound (A), a cyanic acid ester compound (B), an inorganic filler (C), a first acrylonitrile-butadiene rubber (D) having a weight-average molecular weight, measured by GPC, of 100,000 or greater, and a second acrylonitrile-butadiene rubber (E) having a weight-average molecular weight of 1,000-30,000.
More Like This:
| JPS5865778 | BONDING TECHNIQUE |
Inventors:
IDEI HIDEKAZU (JP)
SHIKA SEIJI (JP)
HASEBE KEIICHI (JP)
SHIKA SEIJI (JP)
HASEBE KEIICHI (JP)
Application Number:
PCT/JP2015/083715
Publication Date:
June 09, 2016
Filing Date:
December 01, 2015
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
B32B25/04; C08G59/40; C08J7/043; C08J7/044; C08K3/00; C08L9/02; C08L61/14; C08L63/00; C08L65/00; H05K3/46
Foreign References:
| JP2003246843A | 2003-09-05 | |||
| JP2004193458A | 2004-07-08 | |||
| JPS61188411A | 1986-08-22 | |||
| JPH10337807A | 1998-12-22 | |||
| JP2014205755A | 2014-10-30 | |||
| JPH1154914A | 1999-02-26 | |||
| JP2007262126A | 2007-10-11 | |||
| JPS54157189A | 1979-12-11 | |||
| JPS60186579A | 1985-09-24 |
Attorney, Agent or Firm:
ONO, Shinjiro et al. (JP)
Ono Shinjiro (JP)
Ono Shinjiro (JP)
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