Title:
RESIN SHEET, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/106953
Kind Code:
A1
Abstract:
Provided are: a resin sheet which is capable of maintaining flexibility after curing, and which is suitable for sealing of semiconductor elements; and a semiconductor device which is produced using this resin sheet. A resin sheet which is obtained using a resin composition that contains, as essential ingredients, (A) an epoxy resin that satisfies a specific chemical formula, (B) a phenolic resin curing agent, (C) a curing accelerator and (D) an inorganic filler; a resin-sealed semiconductor device which is obtained by sealing a semiconductor element with use of this resin sheet; and a method for producing this semiconductor device.
Inventors:
SUDO NOBUHIRO (JP)
Application Number:
PCT/JP2018/037093
Publication Date:
June 06, 2019
Filing Date:
October 03, 2018
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
C08G59/24; C08G59/62; C08J5/18; C08K3/36; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| WO2016125664A1 | 2016-08-11 |
Foreign References:
| JP2016180088A | 2016-10-13 | |||
| JP2017179055A | 2017-10-05 | |||
| JP2014029958A | 2014-02-13 | |||
| JP2015061720A | 2015-04-02 | |||
| JP5966113B1 | 2016-08-10 | |||
| JP2016053108A | 2016-04-14 |
Attorney, Agent or Firm:
SAKURA PATENT OFFICE, P.C. (JP)
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