Title:
RESIN SHEET
Document Type and Number:
WIPO Patent Application WO/2017/150231
Kind Code:
A1
Abstract:
This resin sheet is used for a solder resist, and is provided with: a carrier base; and a resin layer that is arranged on the carrier base and is formed from a resin composition for solder resists. The resin layer has a film thickness of from 1 μm to 50 μm (inclusive); and if η is the minimum value of the complex dynamic viscosity as determined by a dynamic viscoelasticity test of the resin layer in a B-stage state, said test being carried out in a measurement range of 50-200°C at a heating rate of 3°C/min at a frequency of 62.83 rad/sec, η is from 100 Pa·s to 3,000 Pa·s (inclusive). A cured product of the resin layer has a storage elastic modulus of from 7 GPa to 40 GPa (inclusive) at 30°C.
Inventors:
TAKAHASHI AKIHITO (JP)
Application Number:
PCT/JP2017/006047
Publication Date:
September 08, 2017
Filing Date:
February 20, 2017
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
H05K3/28; C08K3/36; C08L63/00; C08L79/00; C08L101/00
Foreign References:
| JP2012136693A | 2012-07-19 | |||
| JP2004311527A | 2004-11-04 | |||
| JP2012073600A | 2012-04-12 | |||
| JP2006278993A | 2006-10-12 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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