Title:
RESIN SPACER FOR CHIP STACK PACKAGE AND PREPARATION METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2020/034387
Kind Code:
A1
Abstract:
Disclosed is a resin spacer for a chip stack package, comprising a fiberglass cloth as a substrate accounting for 10 to 60 wt% based on the total weight of the resin spacer, and the following components attached on the fiberglass cloth, in weight percent based on the total weight of the resin spacer: epoxy resin 8 to 40 wt%, quartz powder 10 to 30 wt%, alumina 2 to 10 wt%, calcium oxide 1 to 8 wt%, and a curing agent 1 to 8 wt%, the resin spacer being fabricated by resin mixing, impregnation, half-curing, stacking, and pressing. The resulting resin spacer for a stacked chip package has good flexibility and is less likely to crack, allowing for stacking of more layers of chips on a substrate plate, and effectively reducing risks associated with warping of a package structure and shattering of internal chips. Moreover, the resin spacer has excellent electrical insulation properties and good hydrophilicity.
Inventors:
YANG GUOHONG (CN)
Application Number:
PCT/CN2018/111153
Publication Date:
February 20, 2020
Filing Date:
October 22, 2018
Export Citation:
Assignee:
SU ZHOU DREAM TECH CO LTD (CN)
International Classes:
C08L63/00; C08K3/22; C08K3/36; C08K7/14; C08K13/04; H01L23/31
Foreign References:
| CN105164179A | 2015-12-16 | |||
| CN104212179A | 2014-12-17 | |||
| JP2009203289A | 2009-09-10 | |||
| JPH01132651A | 1989-05-25 | |||
| JP2002161194A | 2002-06-04 | |||
| JP2007099933A | 2007-04-19 |
Attorney, Agent or Firm:
SUZHOU ZHITU INTELLECTUAL PROPERTY FIRM (CN)
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