Title:
RESIN STRUCTURE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN, AND METHOD FOR MANUFACTURING SAID STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2015/163082
Kind Code:
A1
Abstract:
A resin structure (1) provided with a molded resin body (5) and a plurality of electronic components (2) embedded in the resin molded body (5), wherein the molded resin body (5) has a plurality of exposure surfaces on which the electrodes (3) of the electronic components (2) are exposed. Recesses (7) are formed in the molded resin body (5), and the bottom surfaces (13) of the recesses (7) constitute at least one of the plurality of exposure surfaces.
Inventors:
KAWAI WAKAHIRO (JP)
Application Number:
PCT/JP2015/059346
Publication Date:
October 29, 2015
Filing Date:
March 26, 2015
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
H01L23/28; B29C45/14; H01L21/56; H01L25/04; H01L25/18; H05K3/00; H05K3/28; H05K5/00
Foreign References:
| JP2004152982A | 2004-05-27 | |||
| JP2010272756A | 2010-12-02 | |||
| JP2009099593A | 2009-05-07 | |||
| JPH1187385A | 1999-03-30 | |||
| JPH0555715A | 1993-03-05 | |||
| US20130302947A1 | 2013-11-14 |
Other References:
See also references of EP 3136432A4
Attorney, Agent or Firm:
MASUI, Yoshihisa et al. (JP)
Yoshihisa Masui (JP)
Yoshihisa Masui (JP)
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