Title:
RESIN SUBSTRATE COMBINATION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2015/198865
Kind Code:
A1
Abstract:
A resin substrate combination structure (101) is provided with: a first resin substrate (21) which uses flexible resin as a chief material and includes a first portion (41); a second resin substrate (22) which uses flexible resin as a chief material and has a second portion (42) disposed apart from the first portion (41) in a thickness direction; and an insulating member (3) which is disposed so as to envelop the first portion (41) and the second portion (42) while maintaining a relative positional relationship between the first portion (41) and the second portion (42). The insulating member (3) is formed from a material having higher stiffness than those of the chief material of the first resin substrate (21) and the chief material of the second resin substrate (22).
Inventors:
OTSUBO YOSHIHITO (JP)
ARAKI KEISUKE (JP)
ITO YUKI (JP)
KUBOTA KENJI (JP)
ARAKI KEISUKE (JP)
ITO YUKI (JP)
KUBOTA KENJI (JP)
Application Number:
PCT/JP2015/066742
Publication Date:
December 30, 2015
Filing Date:
June 10, 2015
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/14; H05K1/02
Foreign References:
| JPH05283586A | 1993-10-29 | |||
| JP2011071442A | 2011-04-07 | |||
| JP2012060026A | 2012-03-22 | |||
| JPH07183663A | 1995-07-21 | |||
| JP2003243778A | 2003-08-29 |
Attorney, Agent or Firm:
Fukami Patent Office, p. c. (JP)
Patent business corporation Fukami patent firm (JP)
Patent business corporation Fukami patent firm (JP)
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