Title:
RESIN SUBSTRATE AND RESIN SUBSTRATE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/061369
Kind Code:
A1
Abstract:
A resin substrate is provided with a first resin layer (10a) and a second resin layer (10b), a first metal foil pattern (20a) disposed on top of the first resin layer (10a), a second metal foil pattern (20b) disposed on top of the second resin layer (10b), and a resin film (30) disposed in between the first resin layer (10a) and the second resin layer (10b). The first metal foil pattern (20a) and the second metal foil pattern (20b) are bonded together in a state in which a first bonding section (50a) and a second bonding section (50b) have been formed, the first metal foil pattern (20a) and the second metal foil pattern (20b) being directly bonded in the first bonding section and being bonded via a conductive bonding material in the second bonding section. A conductive bonding material (40) is filled into a closed space that is formed by at least one of the first resin layer (10a) and the second resin layer (10b) and by the first metal foil pattern (20a), the second metal foil pattern (20b), and the resin film (30).
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Inventors:
OTSUBO YOSHIHITO (JP)
MINAMI MASAAKI (JP)
MINAMI MASAAKI (JP)
Application Number:
PCT/JP2016/079268
Publication Date:
April 13, 2017
Filing Date:
October 03, 2016
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/14; H05K3/36
Domestic Patent References:
| WO2007125789A1 | 2007-11-08 | |||
| WO2004016054A1 | 2004-02-19 | |||
| WO2001056340A1 | 2001-08-02 |
Foreign References:
| JP2008016690A | 2008-01-24 | |||
| JP2013207115A | 2013-10-07 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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