Title:
RESIN SUBSTRATE AND METHOD FOR MANUFACTURING RESIN SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2020/111191
Kind Code:
A1
Abstract:
A resin substrate (101) is provided with an insulating base material (10A) having a first major surface (VS1) and a second major surface (VS2) which are opposite each other and one of which is parallel to the X-axis direction and the Y-axis direction in orthogonal X, Y, and Z coordinates. The insulating base material (10A) is divided into a first portion (F1) and a second portion (F2A, F2B) which are arrayed in the X-axis direction. The first portion (F1) includes, when equally divided into three parts in the Z-axis direction, a first region (R1) positioned on the side closest to the first major surface (VS1), a second region (R2) positioned on the side closest to the second major surface (VS2), and a third region (R3) sandwiched between the first region (R1) and the second region (R2). The degree of molecular orientation of resin in the Y-axis direction in the first region (R1) is greater than the degree of molecular orientation of resin in the Y-axis direction in the second portion (F2A, F2B) of the insulating base material (10A).
Inventors:
TAKADA RYOSUKE (JP)
Application Number:
PCT/JP2019/046631
Publication Date:
June 04, 2020
Filing Date:
November 28, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/02; H05K3/46
Domestic Patent References:
| WO2014174931A1 | 2014-10-30 |
Foreign References:
| JP2011176013A | 2011-09-08 | |||
| JP2014090041A | 2014-05-15 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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