Title:
RESIN SUBSTRATE AND METHOD FOR PRODUCING RESIN SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/002836
Kind Code:
A1
Abstract:
This resin substrate (10) is provided with a dielectric element (20), first and second ground conductors (50, 40), and shield tapes (60). The dielectric element (20) has a foldable shape. The dielectric element (20) is provided with a signal conductor (30) at a halfway position in the thickness direction. The first ground conductor (50) is arranged on the front surface of the dielectric element (20), and the second ground conductor (40) is arranged on the back surface of the dielectric element (20). A folded part (102) of the first ground conductor (50) is provided with a non-conductor-formation part (500), and a folded part (102) of the second ground conductor (40) is provided with a non-conductor-formation part (400). The shield tapes (60) are arranged at the folded parts (102), and cover the non-conductor-formation parts (400, 500), respectively. The shield tapes (60) are respectively connected to the first and second ground conductors (50, 40), and have electromagnetic shielding properties.
Inventors:
OTSUBO YOSHIHITO (JP)
ITO YUKI (JP)
FUJIMOTO ASATO (JP)
ITO YUKI (JP)
FUJIMOTO ASATO (JP)
Application Number:
PCT/JP2016/069217
Publication Date:
January 05, 2017
Filing Date:
June 29, 2016
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/02
Foreign References:
| JP2009218447A | 2009-09-24 | |||
| JP2007129111A | 2007-05-24 | |||
| JP2013021069A | 2013-01-31 | |||
| JP3173143U | 2012-01-26 | |||
| JP2006019336A | 2006-01-19 | |||
| US20140118969A1 | 2014-05-01 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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