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Patent Searching and Data


Title:
RESIN SUPPLY DEVICE, PRESS UNIT, AND RESIN MOLD DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/029934
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a resin supply device that makes the size of an installation area compact and reduces a work area to improve operability. As a solution, a resin supply unit (Ud) has a roll film accommodation section (10A) and a syringe supply section (11c) arranged to vertically overlap each other at the front end of a device, and has a resin mounting section (10c) arranged next to the syringe supply section (11c).

Inventors:
MURAMATSU YOSHIKAZU (JP)
TAGAMI SHUSAKU (JP)
FUJISAWA MASAHIKO (JP)
KIDA KENJI (JP)
Application Number:
PCT/JP2017/018496
Publication Date:
February 15, 2018
Filing Date:
May 17, 2017
Export Citation:
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Assignee:
APIC YAMADA CORP (JP)
International Classes:
B29C43/34; B29C31/06; B29C43/18; H01L21/56
Domestic Patent References:
WO2012128444A12012-09-27
Foreign References:
JP2015101082A2015-06-04
JP2015107657A2015-06-11
JP2015116728A2015-06-25
Attorney, Agent or Firm:
WATANUKI PATENT SERVICE BUREAU (JP)
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