Title:
RESIN SUPPLY METHOD, RESIN SUPPLY DEVICE, RESIN MOLDING DEVICE, RESIN SETTING METHOD, AND RESIN MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/203888
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a technique with which a trouble, such as the inclusion of air in resin, can be prevented.
The solution comprises, in this order: evacuating an interior (30a) of a chamber (30); ejecting a liquid resin (R) onto a workpiece (W), which is an object to be supplied with, via a nozzle (22) in the interior (30a) of the evacuated chamber (30); stopping the ejection of the liquid resin (R) and the evacuation of the interior (30a) of the chamber (30), and then reciprocating the nozzle (22) in the interior (30a) of the chamber (30).
Inventors:
NAKAZAWA HIDEAKI (JP)
MURAMATSU YOSHIKAZU (JP)
IKEDA MASANOBU (JP)
FUJISAWA MASAHIKO (JP)
KAWAGUCHI MASAKI (JP)
KITAMURA HIDEKI (JP)
MURAMATSU YOSHIKAZU (JP)
IKEDA MASANOBU (JP)
FUJISAWA MASAHIKO (JP)
KAWAGUCHI MASAKI (JP)
KITAMURA HIDEKI (JP)
Application Number:
PCT/JP2017/015360
Publication Date:
November 30, 2017
Filing Date:
April 14, 2017
Export Citation:
Assignee:
APIC YAMADA CORP (JP)
International Classes:
B29C39/42; B29C39/10
Domestic Patent References:
| WO2015159743A1 | 2015-10-22 |
Foreign References:
| JP2000233416A | 2000-08-29 | |||
| JP2012126075A | 2012-07-05 | |||
| JP2014172287A | 2014-09-22 | |||
| JP2013123849A | 2013-06-24 |
Attorney, Agent or Firm:
WATANUKI PATENT SERVICE BUREAU (JP)
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