Title:
RESIN VARNISH FOR INSULATING LAYER FORMATION
Document Type and Number:
WIPO Patent Application WO/2022/180791
Kind Code:
A1
Abstract:
A resin varnish for insulating layer formation that includes a first isocyanate compound, a second isocyanate compound, and a polyamide-imide amine compound, wherein: the first isocyanate compound includes at least one triazine-trione ring structure and a side chain having blocked isocyanate groups at the end bonded to each of the three nitrogens of the triazine-trione ring structure in the molecule; the blocked isocyanate groups are functional groups represented by chemical formula 1; the second isocyanate compound includes at least two terminal chains having the blocked isocyanate groups at the end and at least two urethane structures other than the urethane structures in the blocked isocyanate groups in the molecule; the second isocyanate compound does not include a triazine-trione ring structure in the molecule; and the polyamide-imide amine compound includes at least one amide-imide structure and a structure having at least one amino group bonded to a nitrogen of the amide-imide structure at the end in the molecule. In chemical formula 1, R is an inert group.
Inventors:
SAITA KOHEI (JP)
KOGA TOSHIMI (JP)
FUJIKURA YUICHI (JP)
WATANABE TAKATOSHI (JP)
MATSUI KATSUFUMI (JP)
SUGAWARA JUN (JP)
MATSUURA YUKI (JP)
KOGA TOSHIMI (JP)
FUJIKURA YUICHI (JP)
WATANABE TAKATOSHI (JP)
MATSUI KATSUFUMI (JP)
SUGAWARA JUN (JP)
MATSUURA YUKI (JP)
Application Number:
PCT/JP2021/007370
Publication Date:
September 01, 2022
Filing Date:
February 26, 2021
Export Citation:
Assignee:
TOTOKU TORYO CO LTD (JP)
SUMITOMO ELECTRIC WINTEC INC (JP)
SUMITOMO ELECTRIC WINTEC INC (JP)
International Classes:
C09D175/02; C09D5/25; C09D179/08; H01B3/30; H01B7/00; H01B7/02
Foreign References:
| JP2012097177A | 2012-05-24 | |||
| JP2010135135A | 2010-06-17 | |||
| JP2001006444A | 2001-01-12 | |||
| JP2000353428A | 2000-12-19 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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