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Patent Searching and Data


Title:
RESIN WITH HIGH DAMPING PROPERTIES
Document Type and Number:
WIPO Patent Application WO2003054103
Kind Code:
A3
Abstract:
An adhesive resin composition comprising, based on the total weight of the composition, a first resin component having one or more glass transition temperatures of about 15 to about 50°C; optionally, up to about 49 weight percent of a second resin component having one or more glass transition temperatures greater than about 100°C; and up to about 50 weight percent of a particulate inorganic filler; wherein a tan Delta value of the adhesive resin composition is greater than about 0.2 over a temperature range of about -15 to about 50°C when measured at a frequency of 1 Hz. The adhesive resin compostions are of particular utility in suspension assemblies.

Inventors:
WALKER ROBERT HENRY III
GUO DAVID
Application Number:
US0241019W
Publication Date:
October 23, 2003
Filing Date:
December 19, 2002
Export Citation:
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Assignee:
WORLD PROPERTIES, INC.
International Classes:
B32B15/082; B32B7/12; B32B15/08; C08K3/34; C08K3/40; C09J11/04; C09J119/02; C09J121/00; C09J125/08; C09J133/00; C09J137/00; C09J139/06; C09J161/06; C09J171/02; C09J171/12; C09J201/00; C08K3/00; C08L21/00; (IPC1-7): C09J201/00; C09K3/10; B32B15/08; F16F15/02
Foreign References:
EP0164728A21985-12-18
EP0802251A11997-10-22
JPS60258262A1985-12-20
JPH05295054A1993-11-09
Other References:
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 23 10 February 2001 (2001-02-10)
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