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Patent Searching and Data


Title:
RESINOID GRINDING WHEEL
Document Type and Number:
WIPO Patent Application WO/2007/018074
Kind Code:
A1
Abstract:
Disclosed is a resinoid grinding wheel comprising an epoxy resin as an binder, which is free from the occurrence of chipping or microcracking particularly in the grinding of a hard and brittle material. Also disclosed is a method for production of the resinoid grinding wheel. A resinoid grinding wheel comprising an epoxy resin and an abrasive grain fixed with the epoxy resin, wherein the epoxy resin is a plastic epoxy resin, preferably an epoxy resin modified with dimer acid. The resinoid grinding wheel has a compressive strength of 5 to 20 MPa (as measured in accordance with JIS R1608) and an elastic modulus of 30 to 40 MPa (as measured in accordance with JIS R1602).

Inventors:
DAIDOU MAKOTO (JP)
AIKAWA KAZUYA (JP)
Application Number:
PCT/JP2006/315195
Publication Date:
February 15, 2007
Filing Date:
August 01, 2006
Export Citation:
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Assignee:
KURE NORTON CO LTD (JP)
DAIDOU MAKOTO (JP)
AIKAWA KAZUYA (JP)
International Classes:
B24D3/28; B24D3/00; B24D3/34
Foreign References:
JPS61230871A1986-10-15
JPH07137208A1995-05-30
Attorney, Agent or Firm:
SHAMOTO, Ichio et al. (Section 206 New Ohtemachi Bldg., 2-1, Ohtemachi 2-chome, Chiyoda-k, Tokyo 04, JP)
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