Title:
RESINS FOR USE AS TIE LAYERS IN MULTILAYER FILMS AND MULTILAYER FILMS COMPRISING THE SAME
Document Type and Number:
WIPO Patent Application WO/2018/063578
Kind Code:
A8
Abstract:
The present disclosure provides resins that can be used as a tie layer in a multilayer structure and to multilayer structures comprising one or more tie layers formed from such resins. In one aspect, a resin for use as a tie layer in a multilayer structure comprises a first composition, wherein the first composition comprises at least one ethylene-based polymer and wherein the first composition comprises a MWCDI value greater than 0.9, and a melt index ratio (I10/I2) that meets the following equation: I10/I2 ? 7.0 - 1.2 x log (I2), wherein the first composition comprises 1 to 99 weight percent of the resin; and a maleic anhydride grafted polyethylene comprising a maleic anhydride grafted high density polyethylene, a maleic anhydride grafted linear low density polyethylene, a maleic anhydride grafted polyethylene elastomer, or a combination thereof, wherein the maleic anhydride grafted polyethylene comprises 1 to 99 weight percent of the resin.
Inventors:
ZHENG YONG (US)
GUERRA SUZANNE M (US)
HANSEN SYDNEY E (US)
WALTHER BRIAN W (US)
GUERRA SUZANNE M (US)
HANSEN SYDNEY E (US)
WALTHER BRIAN W (US)
Application Number:
PCT/US2017/047781
Publication Date:
March 28, 2019
Filing Date:
August 21, 2017
Export Citation:
Assignee:
DOW GLOBAL TECHNOLOGIES LLC (US)
International Classes:
B32B7/12; B32B27/08; B32B27/30; B32B27/34; C08L23/04; C08L51/00
Attorney, Agent or Firm:
LINK, Jason, J. (US)
Download PDF: