Title:
RESIST AUXILIARY FILM COMPOSITION, AND PATTERN FORMING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2024/014330
Kind Code:
A1
Abstract:
According to the present invention, it is possible to provide a resist auxiliary film composition containing a resin (A) and a solvent (B), the solvent (B) including a compound (B1) represented by general formula (b-1) below, wherein the content of an active ingredient is 45% by mass or less based on the total amount of the resist auxiliary film composition. (In formula (b-1) above, R0 is an alkyl group having 1-10 carbon atoms, an aryl group having 6-10 carbon atoms, or an acyl group having 1-10 carbon atoms; and R1 is a hydrogen atom or an alkyl group having 1-10 carbon atoms.)
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Inventors:
OKADA TAKUMI (JP)
HOSHINO RYOSUKE (JP)
SATO HIDEYUKI (JP)
KATAGIRI MASAYUKI (JP)
SUZUKI SHU (JP)
ECHIGO MASATOSHI (JP)
HOSHINO RYOSUKE (JP)
SATO HIDEYUKI (JP)
KATAGIRI MASAYUKI (JP)
SUZUKI SHU (JP)
ECHIGO MASATOSHI (JP)
Application Number:
PCT/JP2023/024544
Publication Date:
January 18, 2024
Filing Date:
July 03, 2023
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
G03F7/11; C08L57/00; C08L61/08; C08L83/00; C08L101/00; G03F7/004; G03F7/023; G03F7/039; H01L21/027
Domestic Patent References:
| WO2020004464A1 | 2020-01-02 |
Foreign References:
| JPS62123444A | 1987-06-04 | |||
| JP2007304490A | 2007-11-22 | |||
| JP2001188364A | 2001-07-10 |
Attorney, Agent or Firm:
KOBAYASHI Hiroshi et al. (JP)
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