Title:
RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN
Document Type and Number:
WIPO Patent Application WO/2022/270627
Kind Code:
A1
Abstract:
Provided is a resist composition comprising a resin component (A1), a compound (B0) which is represented by general formula (b0), and a photo-disintegrable base (D0), a generated acid of which is a carboxylic acid having a pka of 0.3-2.5. (In the formula, Rb11-Rb13 are halogen atoms. Rb21-Rb23 are each independently a hydrogen atom or the like. mb1, nb1 and ob1 are integers of 2-5. mb2 is an integer which is 5 - mb1, nb2 is an integer which is 5 - nb1, and ob2 is an integer which is 5 - ob1. R101 is a cyclic group or the like. R102 is a fluorinated alkyl group or a fluorine atom. Y101 is a single bond or a linking group which is divalent and contains an oxygen atom. V101 is a single bond, an alkylene group, or a fluorinated alkylene group.)
Inventors:
NAGAMINE TAKASHI (JP)
INARI TAKATOSHI (JP)
INARI TAKATOSHI (JP)
Application Number:
PCT/JP2022/025354
Publication Date:
December 29, 2022
Filing Date:
June 24, 2022
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
G03F7/004; C07D327/04; C09K3/00; G03F7/039; G03F7/20
Foreign References:
| JP2020091374A | 2020-06-11 | |||
| JP2019182860A | 2019-10-24 | |||
| JP2021071720A | 2021-05-06 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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