Title:
RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN
Document Type and Number:
WIPO Patent Application WO/2023/013592
Kind Code:
A1
Abstract:
A resist composition is adopted that contains a resin component, which has a constituent unit represented by general formula (a0-1), and a compound, which is represented by general formula (d0-1). In general formula (a0-1), R0 is a hydrogen atom, an alkyl group, a halogen atom or a halogenated alkyl group. Vax0 is a single bond or divalent linking group; Wa is a divalent aromatic hydrocarbon group; Va0 is a divalent hydrocarbon group; na0 is an integer 0-2; and Ra00 is an acid dissociable group. In general formula (d0-1), X0 is a bromine atom or an iodine atom. Rm is a hydroxy group, an alkyl group, a fluorine atom or a chlorine atom. nd1 is an integer 1-5, nd2 is an integer 0-4, Yd0 is a divalent linking group or a simple bond. Mm+ represents an organic cation having a valency of m. m is an integer greater than or equal to 1.
Inventors:
KATO HIROKI (JP)
FUJINAMI TETSUO (JP)
ISHII SHUICHI (JP)
FUJINAMI TETSUO (JP)
ISHII SHUICHI (JP)
Application Number:
PCT/JP2022/029513
Publication Date:
February 09, 2023
Filing Date:
August 01, 2022
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
G03F7/004; C07D327/06; C07D333/76; C08F12/22; C08F20/18; G03F7/039; G03F7/20
Foreign References:
| JP2021091666A | 2021-06-17 | |||
| JP2021096465A | 2021-06-24 | |||
| JP2022007909A | 2022-01-13 | |||
| JP2022032972A | 2022-02-25 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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