Title:
RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, COMPOUND, AND POLYMER
Document Type and Number:
WIPO Patent Application WO/2023/140364
Kind Code:
A1
Abstract:
This resist composition generates an acid upon exposure to light and changes in solubility in developing solutions by the action of the acid, and includes a polymer including a constituent unit derived from a compound represented by general formula (a0-1), as a resinous component which changes in solubility in developing solutions by the action of an acid. In general formula (a0-1), W01 is a group containing a polymerizing group, W02 is an aromatic hydrocarbon group, Ya01 is a divalent linking group or a single bond, Ra01 is an acid-dissociable group, Ra02 is an optionally substituted, chain hydrocarbon group or an optionally substituted alicyclic hydrocarbon group, m is an integer of 1 or larger, and n is an integer of 1 or larger.
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Inventors:
ONISHI KOSHI (JP)
MIYAKAWA JUNICHI (JP)
MIYAKAWA JUNICHI (JP)
Application Number:
PCT/JP2023/001761
Publication Date:
July 27, 2023
Filing Date:
January 20, 2023
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
G03F7/039; C08F212/08; G03F7/20
Foreign References:
| JP2022007909A | 2022-01-13 | |||
| JP2005266801A | 2005-09-29 | |||
| JP2022008154A | 2022-01-13 | |||
| JP2018205710A | 2018-12-27 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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