Title:
RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, COMPOUND, AND POLYMER COMPOUND
Document Type and Number:
WIPO Patent Application WO/2023/171739
Kind Code:
A1
Abstract:
The present invention employs a resist composition that contains a resin component that has a structural unit derived from a compound represented by general formula (a0-1). In the general formula, Rm is an alkyl group, a halogenated alkyl group, a halogen atom, or a hydrogen atom, L1 is an aliphatic hydrocarbon group, n is an integer from 0 to 2, and Ra0 is an acid-dissociable group. Ra01 is an aliphatic hydrocarbon group, and Ra02, Ra03, and Ra04 are a hydrocarbon group or a hydrogen atom. Ra01 and Ra02 may bond to form an alicyclic structure. Ra03 and Ra04 may bond to form an alicyclic structure or an aromatic ring structure. The alicyclic structure formed by the bonding of Ra01 and Ra02 and the alicyclic structure or aromatic ring structure formed by the bonding of Ra03 and Ra04 may be condensed. Ra05 is a linear or alicyclic hydrocarbon group or a hydrogen atom.
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Inventors:
SUZUKI ISSEI (JP)
NGUYEN KHANHTIN (JP)
ONISHI KOSHI (JP)
NGUYEN KHANHTIN (JP)
ONISHI KOSHI (JP)
Application Number:
PCT/JP2023/009003
Publication Date:
September 14, 2023
Filing Date:
March 09, 2023
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
G03F7/039; C08F12/02; C08F20/10; G03F7/20
Foreign References:
| JP2010237662A | 2010-10-21 | |||
| CN106554280A | 2017-04-05 | |||
| JP2021067934A | 2021-04-30 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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