Title:
RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, AND COMPOUND
Document Type and Number:
WIPO Patent Application WO/2023/223897
Kind Code:
A1
Abstract:
Provided is a resist composition comprising a resin component (A1) that has a constituent unit (a0) which is derived from a compound represented by general formula (a0-1). In the formula, R is a hydrogen atom, a C1-5 alkyl group, or a C1-5 halogenated alkyl group. Rpg is an acid-dissociable group represented by general formula (a0-pg). A is a cyclic alkene having only one carbon-carbon unsaturated bond in the ring skeleton thereof. Ra01 is a hydrogen atom or a C1-20 monovalent hydrocarbon group. m1 is an integer of 0-20. m2 is an integer of 1-20. * is a bond.
Inventors:
UEHARA TAKUYA (JP)
KATO HIROKI (JP)
KATO HIROKI (JP)
Application Number:
PCT/JP2023/017443
Publication Date:
November 23, 2023
Filing Date:
May 09, 2023
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
G03F7/039; C08F214/14; C08F220/22; G03F7/20
Domestic Patent References:
| WO2013099998A1 | 2013-07-04 | |||
| WO2015045739A1 | 2015-04-02 | |||
| WO2021230300A1 | 2021-11-18 |
Foreign References:
| JP2002003537A | 2002-01-09 | |||
| JP2020071466A | 2020-05-07 | |||
| JP2021067934A | 2021-04-30 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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