Title:
RESIST COMPOSITION, RESIST PATTERN FORMING METHOD, COMPOUND AND ACID DIFFUSION CONTROL AGENT
Document Type and Number:
WIPO Patent Application WO/2024/058075
Kind Code:
A1
Abstract:
The present invention employs a resist composition that contains: a base material component, the solubility of which in a developer solution is changed by the action of an acid; and a compound which is represented by general formula (d0). In formula (d0), Rf represents a fluorinated hydrocarbon group; V0 represents an optionally substituted hydrocarbon group or a single bond; Y0 represents a divalent linking group that comprises an oxygen atom; I represents an iodine atom; x represents an integer of 1 to 4, y represents an integer of 1 to 4, and 2 ≤ x + y ≤ 5 is satisfied; the total number of fluorine atoms contained in x-number of Rf moieties is 5 or more; Mm+ represents a sulfonium cation or an iodonium cation; and m represents an integer of 1 or more. This resist composition is capable of achieving a good balance between higher sensitivity and roughness reduction during the formation of a resist pattern, and enables the formation of a pattern that has a good shape with higher rectangularity.
Inventors:
NGUYEN KHANHTIN (JP)
TODOROKI SEIJI (JP)
ODASHIMA RIN (JP)
KOBAYASHI RYOTA (JP)
TODOROKI SEIJI (JP)
ODASHIMA RIN (JP)
KOBAYASHI RYOTA (JP)
Application Number:
PCT/JP2023/032897
Publication Date:
March 21, 2024
Filing Date:
September 08, 2023
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
G03F7/004; C07D333/76; G03F7/039; G03F7/20
Foreign References:
| JP2021135497A | 2021-09-13 | |||
| JP2020046662A | 2020-03-26 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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