Title:
RESIST COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2004/042475
Kind Code:
A1
Abstract:
A resist composition, characterized in that it comprises (A) a fluorine-containing polymer having an acidic group being blocked with a blocking group having a cycloalkyl group, an organic group having one or more of cycloalkyl groups, a bicycloalkyl group or the like, (B) an acid generating compound capable of generating an acid by the irradiation with a light, and (C) an organic solvent. The resist composition is excellent in the transparency for a vacuum ultraviolet ray such as an F2 excimer laser and in dry etching characteristics and further can be used for forming with ease a resist pattern excellent in sensitivity, resolution, flatness, thermal resistance and the like.
Inventors:
KAWAGUCHI YASUHIDE (JP)
KANEKO ISAMU (JP)
TAKEBE YOKO (JP)
OKADA SHINJI (JP)
YOKOKOJI OSAMU (JP)
KANEKO ISAMU (JP)
TAKEBE YOKO (JP)
OKADA SHINJI (JP)
YOKOKOJI OSAMU (JP)
Application Number:
PCT/JP2003/014158
Publication Date:
May 21, 2004
Filing Date:
November 06, 2003
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
KAWAGUCHI YASUHIDE (JP)
KANEKO ISAMU (JP)
TAKEBE YOKO (JP)
OKADA SHINJI (JP)
YOKOKOJI OSAMU (JP)
KAWAGUCHI YASUHIDE (JP)
KANEKO ISAMU (JP)
TAKEBE YOKO (JP)
OKADA SHINJI (JP)
YOKOKOJI OSAMU (JP)
International Classes:
C08F8/00; C08F8/02; C08F14/18; C08F16/02; C08F16/24; C08F36/16; G03C1/492; G03F7/004; G03F7/039; H01L21/027; (IPC1-7): G03F7/039; C08F8/02; C08F16/02; C08F16/24; H01L21/027
Domestic Patent References:
| WO2001098834A1 | 2001-12-27 |
Foreign References:
| US20010038969A1 | 2001-11-08 | |||
| JP2001181346A | 2001-07-03 | |||
| JP2003140349A | 2003-05-14 | |||
| JP2003255544A | 2003-09-10 | |||
| JP2003155540A | 2003-05-30 |
Other References:
See also references of EP 1580600A4
Attorney, Agent or Firm:
Senmyo, Kenji (38 Kanda-Higashimatsushitach, Chiyoda-ku Tokyo, JP)
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