Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIST DEVELOPER, METHOD FOR FORMING A RESIST PATTERN AND METHOD FOR MANUFACTURING A MOLD
Document Type and Number:
WIPO Patent Application WO/2011/125571
Kind Code:
A1
Abstract:
The disclosed resist developer is used when developing by irradiating an energy beam onto a resist layer containing a polymer of α-chloro methacrylate and α-methylstyrene for rendering or exposure, and contains a fluorocarbon-containing solvent (A) and an alcohol solvent (B), the latter of which has higher solubility relative to the resist layer than the former.

Inventors:
IYAMA HIROMASA (JP)
KOBAYASHI HIDEO (JP)
Application Number:
PCT/JP2011/057530
Publication Date:
October 13, 2011
Filing Date:
March 28, 2011
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HOYA CORP (JP)
IYAMA HIROMASA (JP)
KOBAYASHI HIDEO (JP)
International Classes:
G03F7/32; G03F7/039; H01L21/027
Foreign References:
JPH02221962A1990-09-04
JP2009226762A2009-10-08
JP2006227174A2006-08-31
JP2000039717A2000-02-08
JPH10228117A1998-08-25
Attorney, Agent or Firm:
ANIYA Setuo et al. (JP)
Ani store Setsuo (JP)
Download PDF:
View/Download PDF      PDF Help
Claims:



 
Previous Patent: DONOR SUBSTRATE FOR TRANSFER, DEVICE MANUFACTURING METHOD AND ORGANIC EL ELEMENT

Next Patent: INFORMATION PROCESSING DEVICE, INFORMATION RECORDING MEDIUM, INFORMATION PROCESSING METHOD, AND PROG...