Title:
RESIST-FORMING SUBSTRATE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2013/118455
Kind Code:
A1
Abstract:
A resist-forming substrate has a first insulating layer, a first wiring formed on a first surface of the first insulating layer, a thin-film resist layer formed on a second surface of the first insulating layer, and a first via-hole conductor. The first via-hole conductor passes through the first insulating layer and is electrically connected with the first wiring and the thin-film resist layer. Nickel is a primary component of the thin-film resist layer. The first via-hole conductor has a metal portion having a low-melting-point metal and a high-melting-point metal, and a paste resin portion. The low-melting-point metal includes tin and bismuth, and has a melting point no higher than 300°. The high-melting-point metal includes at least one of either copper or silver, and has a melting point no lower than 900°. Both the paste resin portion and the metal portion of the first via-hole conductor contact the thin-film resist layer.
Inventors:
SUGAYA YASUHIRO
ISHITOMI HIROYUKI
NAKAMURA TADASHI
ISHITOMI HIROYUKI
NAKAMURA TADASHI
Application Number:
PCT/JP2013/000454
Publication Date:
August 15, 2013
Filing Date:
January 29, 2013
Export Citation:
Assignee:
PANASONIC CORP (JP)
International Classes:
H05K1/11; H05K3/46; H05K1/16; H05K3/40
Foreign References:
| JP2009135196A | 2009-06-18 | |||
| JP2002094242A | 2002-03-29 | |||
| JP2004311628A | 2004-11-04 | |||
| JP2008544551A | 2008-12-04 | |||
| JP2010258019A | 2010-11-11 | |||
| JP2008160150A | 2008-07-10 |
Attorney, Agent or Firm:
NAITO, Hiroki et al. (JP)
Hiroki Naito (JP)
Hiroki Naito (JP)
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Claims: