Title:
RESIST PATTERN INSPECTION METHOD, RESIST PATTERN MANUFACTURING METHOD, SUBSTRATE SELECTION METHOD, AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/157895
Kind Code:
A1
Abstract:
A resist pattern inspection method according to this invention comprises an appearance inspection step for inspecting the appearance of a resist pattern on the basis of reflected light from the substrate that the resist pattern is formed on. A resist pattern manufacturing method according to this invention comprises a resist pattern formation step for forming a resist pattern on a substrate and a coloring step for coloring the resist pattern after the resist pattern formation step. A substrate selection method according to this invention comprises an appearance inspection step for inspecting the appearance of a resist pattern on the basis of reflected light from the substrate that the resist pattern is formed on and an evaluation step for evaluating the resist pattern on the basis of the appearance inspection in the appearance inspection step. A printed circuit board manufacturing method according to this invention comprises a conductor pattern formation step for forming a conductor pattern by etching or plating a substrate evaluated in the substrate selection method as having a resist pattern meeting a standard.
Inventors:
TAKEDA AKIKO (JP)
KAGUCHI YOSUKE (JP)
KUME MASAKAZU (JP)
KAGUCHI YOSUKE (JP)
KUME MASAKAZU (JP)
Application Number:
PCT/JP2021/002093
Publication Date:
July 28, 2022
Filing Date:
January 21, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
G01N21/956
Foreign References:
| JPH07336024A | 1995-12-22 | |||
| JPH09257640A | 1997-10-03 | |||
| JPH10170715A | 1998-06-26 | |||
| JPH04152343A | 1992-05-26 | |||
| JP2006086154A | 2006-03-30 | |||
| US20200183283A1 | 2020-06-11 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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