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Title:
RESIST REMOVING LINE
Document Type and Number:
WIPO Patent Application WO/2007/129389
Kind Code:
A1
Abstract:
A resist is removed without leaving uneven streaks on a substrate. A line for removing a resist comprising a plurality of ribs, having the resist on its top, arranged at predetermined intervals on the surface of the substrate comprises a resist removing part. The resist removing part comprises a peeling liquid application nozzle for applying a misty peeling liquid having a smaller particle diameter than the rib interval onto the surface of the substrate to wet the substrate surface, and a peeling liquid supply part for allowing the peeling liquid to further flow onto the wetted substrate surface to separate the resist.

Inventors:
OOKUBO, Tatsuya (1815Tajiri, Kunitomi-cho, Higashimorokata-gu, Miyazaki 94, 8801194, JP)
大久保 竜也 (〒94 宮崎県東諸県郡国富町田尻1815 富士通日立プラズマディスプレイ株式会社内 Miyazaki, 8801194, JP)
FUJINAGA, Akihiro (1815Tajiri, Kunitomi-cho, Higashimorokata-gu, Miyazaki 94, 8801194, JP)
Application Number:
JP2006/309110
Publication Date:
November 15, 2007
Filing Date:
May 01, 2006
Export Citation:
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Assignee:
FUJITSU HITACHI PLASMA DISPLAY LIMITED (1815, Tajiri Kunitomi-cho, Higashimorokata-gu, Miyazaki 94, 8801194, JP)
富士通日立プラズマディスプレイ株式会社 (〒94 宮崎県東諸県郡国富町田尻1815 Miyazaki, 8801194, JP)
OOKUBO, Tatsuya (1815Tajiri, Kunitomi-cho, Higashimorokata-gu, Miyazaki 94, 8801194, JP)
大久保 竜也 (〒94 宮崎県東諸県郡国富町田尻1815 富士通日立プラズマディスプレイ株式会社内 Miyazaki, 8801194, JP)
International Classes:
G03F7/42; H01L21/027; G03F7/42; H01L21/02
Attorney, Agent or Firm:
NOGAWA, Shintaro (Nogawa Patent Office, Minamimorimachi Park Bldg.1-3, Nishitenma 5-chome, Kita-ku, Osaka-sh, Osaka 47, 5300047, JP)
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