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Title:
RESIST STRIPPER COMPOSITION FOR FORMING COPPER-BASED WIRING
Document Type and Number:
WIPO Patent Application WO/2011/031028
Kind Code:
A2
Abstract:
Disclosed is a resist stripper composition for forming copper-based wiring, which uses a compound containing sulfone and/or sulfine and/or an ester as the stripper and which can effectively prevent the corrosion of a conductive metal layer of copper or copper alloy wiring and an insulating layer of silicon oxide or silicon nitride which are disposed under the resist, even without the use of isopropanol as an intermediate cleaner, and also can cleanly remove the deteriorated and/or cured resist even at low temperature in a short period of time.

Inventors:
HONG HUN-PYO (KR)
HONG HYUNG-PYO (KR)
KIM TAE-HEE (KR)
LEE SEUNG-YONG (KR)
KIM BYOUNG-MOOK (KR)
Application Number:
PCT/KR2010/005854
Publication Date:
March 17, 2011
Filing Date:
September 09, 2010
Export Citation:
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Assignee:
DONGWOO FINE CHEM CO LTD (KR)
HONG HUN-PYO (KR)
HONG HYUNG-PYO (KR)
KIM TAE-HEE (KR)
LEE SEUNG-YONG (KR)
KIM BYOUNG-MOOK (KR)
International Classes:
G03F7/42; H01L21/306
Foreign References:
KR100378551B12003-03-29
KR100742119B12007-07-24
KR20060014388A2006-02-15
KR20080098310A2008-11-07
KR20080098311A2008-11-07
Attorney, Agent or Firm:
HANYANG PATENT FIRM (412-1 Dogok-dong Gangnam-gu, Seoul 135-854, KR)
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