Title:
RESIST UNDERLAYER FILM FORMATION COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/184380
Kind Code:
A1
Abstract:
[Problem] The present invention addresses the problem of providing a resist underlayer film formation composition that is capable of exhibiting high reflow properties through a step for applying the composition on a substrate and heating the composition, and that can be flatly applied even on a multilevel substrate so as to enable formation of a planarized film. [Solution] The resist underlayer film formation composition according to the present invention contains an organic solvent and a copolymer having a repeating structural unit represented by formula (1) and/or a repeating unit represented by formula (2). (In formula (1) and formula (2), R1 represents a functional group represented by formula (3), in formula (3), Q1 and Q2 each independently represent a hydrogen atom or an alkyl group having 1-5 carbon atoms, * represents an end of a bond with an oxygen atom, and in formula (2), X1 represents an organic group having 1-50 carbon atoms, and i and j each independently represent 0 or 1.)
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Inventors:
OGATA HIROTO (JP)
TOKUNAGA HIKARU (JP)
NISHIMAKI HIROKAZU (JP)
NAKAJIMA MAKOTO (JP)
TOKUNAGA HIKARU (JP)
NISHIMAKI HIROKAZU (JP)
NAKAJIMA MAKOTO (JP)
Application Number:
PCT/JP2020/009438
Publication Date:
September 17, 2020
Filing Date:
March 05, 2020
Export Citation:
Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
G03F7/11; H01L21/027
Domestic Patent References:
| WO2018016615A1 | 2018-01-25 | |||
| WO2018203540A1 | 2018-11-08 | |||
| WO2019031556A1 | 2019-02-14 | |||
| WO2018190380A1 | 2018-10-18 |
Foreign References:
| JP2018063382A | 2018-04-19 |
Attorney, Agent or Firm:
HANABUSA PATENT & TRADEMARK OFFICE (JP)
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