Title:
RESIST UNDERLAYER FILM-FORMING COMPOSITION WHICH CONTAINS ALICYCLIC SKELETON-CONTAINING CARBAZOLE RESIN
Document Type and Number:
WIPO Patent Application WO/2013/005797
Kind Code:
A1
Abstract:
[Problem] To provide a resist underlayer film to be used in a lithography process, which has high n value and low k value and is capable of effectively reducing the reflection of light having a wavelength of 193 nm from the substrate in a three-layer process wherein the resist underlayer film is used in combination with a silicon-containing intermediate layer. [Solution] A resist underlayer film-forming composition to be used in a lithography process, which contains a polymer having a unit structure that contains a reaction product of a fused heterocyclic compound and a bicyclo ring compound. The fused heterocyclic compound is carbazole or a substituted carbazole. The bicyclo ring compound is dicyclopentadiene, a substituted dicyclopentadiene, tetracyclo[4.4.0.12,5.17,10]dodeca-3,8- diene or a substituted tetracyclo[4.4.0.12,5.17,10]dodeca-3,8- diene.
Inventors:
SHINJO TETSUYA (JP)
SOMEYA YASUNOBU (JP)
HASHIMOTO KEISUKE (JP)
KARASAWA RYO (JP)
SOMEYA YASUNOBU (JP)
HASHIMOTO KEISUKE (JP)
KARASAWA RYO (JP)
Application Number:
PCT/JP2012/067201
Publication Date:
January 10, 2013
Filing Date:
July 05, 2012
Export Citation:
Assignee:
NISSAN CHEMICAL IND LTD (JP)
SHINJO TETSUYA (JP)
SOMEYA YASUNOBU (JP)
HASHIMOTO KEISUKE (JP)
KARASAWA RYO (JP)
SHINJO TETSUYA (JP)
SOMEYA YASUNOBU (JP)
HASHIMOTO KEISUKE (JP)
KARASAWA RYO (JP)
International Classes:
G03F7/11; C08G61/00; H01L21/027
Domestic Patent References:
| WO2010021359A1 | 2010-02-25 |
Foreign References:
| JP2008096684A | 2008-04-24 | |||
| JP2010528334A | 2010-08-19 |
Attorney, Agent or Firm:
HANABUSA, Tsuneo et al. (JP)
Sepal Tsuneo (JP)
Sepal Tsuneo (JP)
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Claims: