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Title:
RESIST UNDERLAYER FILM-FORMING COMPOSITION COMPRISING CARBONYL-CONTAINING POLYHYDROXY AROMATIC RING NOVOLAC RESIN
Document Type and Number:
WIPO Patent Application WO/2014/092155
Kind Code:
A1
Abstract:
[Problem] To provide a resist underlayer film that is used in a lithographic process, said resist underlayer film having highly resistance to dry etching, wiggling resistance, heat resistance, and the like. [Solution] Formula (1): This resist underlayer film-forming composition for lithography contains a polymer comprising the structural unit of formula (1). (In formula (1), A represents a hydroxy group-substituted arylene group with 6 to 40 carbon atoms derived from a polyhydroxy aromatic compound. B represents an arylene group with 6 to 40 carbon atoms, or a heterocyclic group with 4 to 30 carbon atoms, which contains a nitrogen atom, an oxygen atom, a sulfur atom, or a combination thereof. X+ represents H+, NH4 +, a primary ammonium ion, a secondary ammonium, a tertiary ammonium ion, or a quaternary ammonium ion. T represents a hydrogen atom; or an alkyl group with 1 to 10 carbon atoms or an aryl group with 6 to 40 carbon atoms having, as optional substituents, a halogen group, a hydroxy group, a nitro group, an amino group, a carboxylic acid ester group and a nitrile group, or a combination thereof; or a heterocyclic group with 4 to 30 carbon atoms, which contains a nitrogen atom, an oxygen atom, a sulfur atom, or a combination thereof. B and T may form a ring with 4 to 40 carbon atoms in combination with a carbon atom that binds B and T.)

Inventors:
SOMEYA YASUNOBU (JP)
KARASAWA RYO (JP)
HASHIMOTO KEISUKE (JP)
SHINJO TETSUYA (JP)
SAKAMOTO RIKIMARU (JP)
Application Number:
PCT/JP2013/083345
Publication Date:
June 19, 2014
Filing Date:
December 12, 2013
Export Citation:
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Assignee:
NISSAN CHEMICAL IND LTD (JP)
International Classes:
G03F7/11; C08G8/04; G03F7/26; H01L21/027
Domestic Patent References:
WO2010147155A12010-12-23
Foreign References:
JPH032867A1991-01-09
Attorney, Agent or Firm:
HANABUSA, Tsuneo et al. (JP)
Sepal Tsuneo (JP)
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