RESIST UNDERLAYER FILM FORMING COMPOSITION

Title:

RESIST UNDERLAYER FILM FORMING COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2019/059210

Kind Code:

A1

Abstract:

This resist underlayer film forming composition contains a resin containing a unit structure represented by formula (1): [in formula (1), R1 represents a thiadiazole group which is optionally substituted with a C1-6 alkyl group optionally interrupted by a carboxy group, a C1-6 alkyl group optionally substituted with a hydroxyl group, or a C1-4 alkylthio group, and R2 represents a hydrogen atom or formula (2): (in formula (2), R1 is the same as defined above, and * represents a binding moiety)]. The resist underlayer film forming composition provides a resist underlayer film which has excellent solvent resistance, excellent optical parameters, an excellent dry etching rate, and excellent embeddability.

More Like This:

JPH0661645	PRODUCTION OF THIN FILM MULTILAYER BOARD
JPH01154138	MANUFACTURE OF MULTI-LAYER PLANAR PHOTOSENSITIVE RECORDING MATERIAL AND PHOTOPOLYMERIZED PRINTING PLATE OR RELIEF PLATE AND PHOTORESIST
JPH08334898	PHOTOPOLYMERIZABLE COMPOSITION AND IMAGE FORMING METHOD USING THE SAME

Inventors:

TAMURA MAMORU (JP)
OGATA HIROTO (JP)
KISHIOKA TAKAHIRO (JP)

Application Number:

PCT/JP2018/034584

Publication Date:

March 28, 2019

Filing Date:

September 19, 2018

Export Citation:

Click for automatic bibliography generation Help

Assignee:

NISSAN CHEMICAL CORP (JP)

International Classes:

G03F7/11; C08G59/14; G03F7/20; G03F7/26; H01L21/027

Domestic Patent References:

WO2003071357A1	2003-08-28
WO2017002653A1	2017-01-05
WO2015041208A1	2015-03-26
WO2014024836A1	2014-02-13

Foreign References:

JP2010164965A	2010-07-29
JP2010186174A	2010-08-26