Title:
RESIST UNDERLAYER FILM-FORMING COMPOSITION THAT INCLUDES ACID CATALYST-SUPPORTING POLYMER
Document Type and Number:
WIPO Patent Application WO/2022/196606
Kind Code:
A1
Abstract:
The present invention provides a composition for forming a resist underlayer film with which a desired resist pattern can be formed, a method for manufacturing a resist pattern wherein said resist underlayer film-forming composition is used, and a method for manufacturing a semiconductor device. The resist underlayer film-forming composition includes a polymer that supports an acid compound at a terminal end thereof, and a solvent. The acid compound may be ionically bonded to a base that is present at the terminal end of the polymer. Said terminal end may be represented by formula (1) (in the formula, A1 represents an acid compound, B represents a basic structure, and * represents a section of bonding with a polymer residue).
Inventors:
SHIMIZU SHOU (JP)
WAKAYAMA HIROYUKI (JP)
TAMURA MAMORU (JP)
WAKAYAMA HIROYUKI (JP)
TAMURA MAMORU (JP)
Application Number:
PCT/JP2022/011190
Publication Date:
September 22, 2022
Filing Date:
March 14, 2022
Export Citation:
Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
C08G59/14; G03F7/11; H01L21/027
Domestic Patent References:
| WO2011018928A1 | 2011-02-17 | |||
| WO2010071155A1 | 2010-06-24 | |||
| WO2015163195A1 | 2015-10-29 |
Foreign References:
| JP2012022191A | 2012-02-02 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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