RESISTOR FILM LAMINATE, METHOD FOR MANUFACTURING RESISTOR FILM LAMINATE, COMPONENT COMPRISING RESISTOR FILM LAMINATE, AND METHOD FOR MANUFACTURING COMPONENT COMPRISING RESISTOR FILM LAMINATE

WIPO Patent Application WO/2003/088276

A1

A resistor film laminate which enables a resistor having a required resistance value to be fabricated in a wiring pattern formed by etching, a method for manufacturing the resistor film laminate, a component comprising the resistor film laminate, and a method for manufacturing the component comprising the resistor film laminate. A resistor film laminate (20) that is a laminate of a first conductive plate (22), a second conductive plate (26), and a resistor film (24) interposed there between is subjected to activation of the side to be joined, of the first and second conductive plates (22 and 26). After the resistor film (24) is stacked on at least one of the first and second conductive plates (22 and 26), these plates (22 and 26) are joined, with the resistor films (24) of the plates (22 and 26) inside. This process provides a resistor film laminate (20) which enables a resistor having a required resistance value to be formed in a wiring pattern. This resistor film laminate (20) is used to manufacture a component applied to a printed wiring board, an IC package, and the like.

SAIJO KINJI (JP)
YOSHIDA KAZUO (JP)
OHSAWA SHINJI (JP)

PCT/JP2003/004211

October 23, 2003

April 02, 2003

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TOYO KOHAN CO LTD (JP)
SAIJO KINJI (JP)
YOSHIDA KAZUO (JP)
OHSAWA SHINJI (JP)

H01C17/00; H01C17/28; H05K1/16; H05K3/40; (IPC1-7): H01C7/00; B32B7/02; C23F4/00

JPS59182592A	1984-10-17
JPH01224184A	1989-09-07

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