Title:
RESONANCE APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/261630
Kind Code:
A1
Abstract:
The present invention reduces stress applied to a connection portion between a support arm and a holding part. This resonance apparatus is provided with: a resonator including a base, a vibration arm extending from one end of the base along a first direction, a holding part disposed in at least a portion of the periphery of the vibration arm so as to vibratably hold the vibration arm, and a support arm which connects the base to the holding part; and a first substrate including a first recess which forms at least a portion of a vibration space of the resonator, and a first limitation part spaced part from the support arm by a first distance in the thickness direction, wherein the first distance is less than a distance between the bottom surface of the first recess and the vibration arm in the thickness direction of the first substrate.
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Inventors:
INOUE YOSHIHISA (JP)
KAAJAKARI VILLE (US)
KAWAI RYOTA (JP)
KAAJAKARI VILLE (US)
KAWAI RYOTA (JP)
Application Number:
PCT/JP2020/003845
Publication Date:
December 30, 2020
Filing Date:
February 03, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/24
Domestic Patent References:
| WO2018008480A1 | 2018-01-11 |
Foreign References:
| JP2010147666A | 2010-07-01 | |||
| JP2016213807A | 2016-12-15 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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