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Patent Searching and Data


Title:
RESONANCE DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/212677
Kind Code:
A1
Abstract:
The present invention adjusts resonance frequency without impairing the piezoelectric property of a resonator. The present invention comprises: a step for preparing a lower cover; a step for disposing a substrate such that the lower surface of the substrate faces the lower cover, and forming a first electrode layer, a piezoelectric film, and a second electrode layer in order on the upper surface of the substrate; a step for forming a vibration arm that performs bending vibration from the first electrode layer, the second electrode layer, and the piezoelectric film, and forming a resonator having the vibration arm; and a step for disposing an upper cover such that the upper cover faces the lower cover with the resonator interposed therebetween. The present invention further comprises, before or after the step for disposing the upper cover, a step for adjusting the frequency of the resonator by applying voltage between the first electrode layer and the second electrode layer, exciting the vibration arm, and causing part of the vibration arm to collide with the lower cover and/or the upper cover.

Inventors:
MORINAGA SHUNGO (JP)
Application Number:
PCT/JP2017/002299
Publication Date:
December 14, 2017
Filing Date:
January 24, 2017
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/24; H03H3/007
Foreign References:
JP2014175809A2014-09-22
JP2015167305A2015-09-24
JP2012070419A2012-04-05
JP2013126104A2013-06-24
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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