Title:
RESONANCE DEVICE AND RESONANCE DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/097328
Kind Code:
A1
Abstract:
Provided are a resonance device and a resonance device manufacturing method that make it possible to suppress junction defects at a junction. The resonance device 1 comprises: a MEMS substrate 50 that includes a resonator 10; a top cover 30; and a junction 60 that is electroconductive and that joins the MEMS substrate 50 and the top cover 30. The MEMS substrate 50 further includes: a wiring layer 81 that is electrically connected to a Si substrate F2, which is a lower electrode of the resonator 10; and a diffusion prevention layer 85 that electrically connects the wiring layer 81 and the junction 60.
Inventors:
HIGUCHI YOSHIYUKI (JP)
FUKUMITSU MASAKAZU (JP)
FUKUMITSU MASAKAZU (JP)
Application Number:
PCT/JP2021/025075
Publication Date:
May 12, 2022
Filing Date:
July 02, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
B81B3/00; B23K20/00; B81C3/00; H03H3/007; H03H9/24
Domestic Patent References:
| WO2019155663A1 | 2019-08-15 | |||
| WO2011111541A1 | 2011-09-15 | |||
| WO2020085188A1 | 2020-04-30 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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