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Patent Searching and Data


Title:
RESONATOR DEVICE MODULE
Document Type and Number:
WIPO Patent Application WO/2019/041506
Kind Code:
A1
Abstract:
The present application relates to a resonator device module. The resonator device module comprises a module housing provided with an accommodating region and a rear sound cavity in communication with each other. An assembly gap is provided in a region of the module housing forming part of the rear sound cavity, and the rear sound cavity communicates with the outside of the device via the assembly gap. A resonator device component is disposed within the accommodating region, and configured to transmit a sound generated during operation to the rear sound cavity. A sound absorption component comprises an assembly board, a sound-permeable package, and a sound absorbing material, wherein the sound-permeable package is configured to allow a sound from an outside portion to be transmitted into the sound-permeable package, the sound absorbing material is disposed inside the sound-permeable package, the sound-permeable package is fixedly provided on the assembly board, the entire assembly board fits within the assembly gap, thereby sealing the assembly gap, and the sound-permeable package is located within the rear sound cavity.

Inventors:
SU TAO (CN)
ZHANG JUN (CN)
ZHANG CHENGFEI (CN)
Application Number:
PCT/CN2017/108379
Publication Date:
March 07, 2019
Filing Date:
October 30, 2017
Export Citation:
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Assignee:
GOERTEK INC (CN)
International Classes:
H04R9/06; G10K11/16
Foreign References:
CN207200975U2018-04-06
CN206302557U2017-07-04
CN106057187A2016-10-26
CN206341410U2017-07-18
CN202979509U2013-06-05
Attorney, Agent or Firm:
BEYOND TALENT PATENT AGENT FIRM (CN)
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